The TLS technique is a completely new approach to the separation of ceramic substrates. It relies on localized surface heating accomplished with a laser beam and subsequent cooling of that surface area. This creates strong tension near the surface, causing a defined crack in the material. With appropriate process parameter settings the material can either be cut through its full thickness or a pre-weakened break line can be fabricated where functional holes have to be drilled with the same machine.

System Design:
Single or multiple head set up

Process:
Scribing, cutting, drilling

Materials:
Al₂O₃, ZrO₂

Cutting speed:
up to 400mm/s