JENOPTIK Semiconductor and Photovoltaik machines
JENOPTIK-VOTAN™ G Semi
(semiconductor wafer)
Application
JENOPTIK-VOTAN™ G Semi is used for the wafer-dicing of silicon, GaAs or SiC by means of various laser technologies. The system is designed for high precision applications in the clean room.
(semiconductor wafer)
Application
JENOPTIK-VOTAN™ G Semi is used for the wafer-dicing of silicon, GaAs or SiC by means of various laser technologies. The system is designed for high precision applications in the clean room.
Examples of use
Waferdicing with laser
Specific strengths
• Higher density - more chips per wafer
• Separating with 0-gap
• Exact cut-guidance
• Higher product quality: extremely sleek edges enhance electrical and optical characteristics
• No chipping or micro cracks, thus higher yield
• Minimized heat affected zone (HAZ)
• Particle-free and dry process
Waferdicing with laser
Specific strengths
• Higher density - more chips per wafer
• Separating with 0-gap
• Exact cut-guidance
• Higher product quality: extremely sleek edges enhance electrical and optical characteristics
• No chipping or micro cracks, thus higher yield
• Minimized heat affected zone (HAZ)
• Particle-free and dry process
We are a proud winner of the prestigious "Best of the West" SEMICON West 2008 award. We received it for the VOTAN G Semi, a wafer dicing system that uses thermal laser separation (TLS).
Please click here for our press release
Please click here for our press release